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Real-time News
On June 30th, South Korean media outlet The Bell reported on the 26th that Samsung Electronics is accelerating its development of the 1.4nm (SF1.4) process node. This advanced process was initially planned for mass production in 2027, but due to a shift in the focus of its foundry business, mass production has been postponed to 2029. The report indicates that Samsung Electronics recently shared its SF1.4 process solutions with major semiconductor equipment companies such as Applied Materials and Lam Research, hoping to achieve upstream and downstream collaboration and accelerate the development of the most suitable equipment combination for this node, including customized versions of standard equipment. Samsung Electronics has already acquired High NA EUV lithography patterning equipment from ASML, which is deployed in the NRD-K semiconductor R&D complex. For Samsung Electronics, the High NA EUV lithography machine is expected to be used in production at the SF1.4 node as early as possible.On June 30th, Applied Materials unveiled its product line of 3D chip manufacturing equipment for AI semiconductor applications. This series of equipment focuses on planarization, deposition, and metrology for advanced packaging processes such as high-bandwidth memory (HBM), chiplets, and hybrid bonding. Specifically, the unveiled equipment includes advanced chemical mechanical polishing (CMP), electrochemical vapor deposition (ECD), and plasma-enhanced chemical vapor deposition (PECVD) equipment for packaging, and also adds electron beam-based process control equipment and upgrades its epitaxial equipment for DRAM processes.On June 30th, Didi Chuxing (02559.HK), a Hong Kong-listed company, saw its shares surge by over 80% in early trading. This followed a joint announcement yesterday from the company and Tongcheng Travel (00780.HK), stating that Tongcheng Travel, through its wholly-owned subsidiary eLong, Inc., would launch a voluntary conditional full cash takeover bid for Didi Chuxing. The announcement revealed that five major shareholders of Didi Chuxing had signed irrevocable commitments, with the shares to be offered representing approximately 53.70% of Didi Chuxings issued share capital. The announcement clarified that the acquisition was not intended to privatize Didi Chuxing. Furthermore, Didi Chuxing proposed a special cash dividend of HK$1.1745 per share, subject to the fulfillment of all conditions. Shareholders who accept the share offer will still be entitled to the special cash dividend, regardless of whether they accept the share offer.JERA, Japans largest power company, signed a memorandum of understanding with Thailands Electricity Generating Corporation to jointly develop the value chain of hydrogen and ammonia in Thailand.The AI application sector in Hong Kong stocks continued its strong performance, with Zhipu (02513.HK) rising more than 10%, Zhixing Technology (01274.HK) rising more than 5%, and Horizon Robotics (09660.HK) and WeRide-W (00800.HK) following suit.
